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News

Surface Mount Packages for Electronic Devices
Sensor + Test 2008


Kyoto / Neuss8 - Kyocera Fineceramics GmbH will present its packaging solutions for electronic devices at the measurement fair "Sensor + Test" in Nuremberg form May 6 to 8, hall 7, booth 7-364.

Kyocera develops new TEC range for opto- electronic applications
ECOC 2007


Kyoto/ Neuss- Kyocera Corporation, a leading supplier of fiber optic components, is increasing its Thermo-electric Cooler (TEC) product availability. The new range is suitable for use in opto-electronic applications in order to stabilize laser diode based products. Kyocera displays its new TEC series at ECOC 2007, September 16th-20th, at booth 12091.



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